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Title: Adhesive bonding via exposure to variable frequency microwave radiation

Abstract

Adhesive bonding through the application of variable frequency microwave (VFM) radiation has been evaluated as an alternative curing method for joining composite materials. The studies showed that the required cure time of a thermosetting epoxy adhesive is substantially reduced by the use of VFM when compared to conventional (thermal) curing methods. Variable frequency microwave processing appeared to yield a slight reduction in the required adhesive cure time when compared to processing by the application of single frequency microwave radiation. In contrast to the single frequency processing, the variable frequency methodology does not readily produce localized overheating (burnt or brown spots) in the adhesive or the composite. This makes handling and location of the sample in the microwave oven less critical for producing high quality bonds and allows for a more homogeneous distribution of the cure energy. Variable frequency microwave processing is a valuable alternative method for rapidly curing thermoset adhesives at low input power levels.

Authors:
; ;
Publication Date:
Research Org.:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
226052
Report Number(s):
CONF-960401-11
ON: DE96008658; TRN: AHC29610%%94
DOE Contract Number:  
AC05-96OR22464
Resource Type:
Technical Report
Resource Relation:
Conference: Spring meeting of the Materials Research Society (MRS), San Francisco, CA (United States), 8-12 Apr 1996; Other Information: PBD: [1996]
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COMPOSITE MATERIALS; BONDING; ADHESIVES; CURING; MICROWAVE RADIATION; EPOXIDES; COMPARATIVE EVALUATIONS; AUTOMOBILES; MECHANICAL PROPERTIES; EXPERIMENTAL DATA; USES

Citation Formats

Paulauskas, F L, McMillan, A D, and Warren, C D. Adhesive bonding via exposure to variable frequency microwave radiation. United States: N. p., 1996. Web. doi:10.2172/226052.
Paulauskas, F L, McMillan, A D, & Warren, C D. Adhesive bonding via exposure to variable frequency microwave radiation. United States. https://doi.org/10.2172/226052
Paulauskas, F L, McMillan, A D, and Warren, C D. 1996. "Adhesive bonding via exposure to variable frequency microwave radiation". United States. https://doi.org/10.2172/226052. https://www.osti.gov/servlets/purl/226052.
@article{osti_226052,
title = {Adhesive bonding via exposure to variable frequency microwave radiation},
author = {Paulauskas, F L and McMillan, A D and Warren, C D},
abstractNote = {Adhesive bonding through the application of variable frequency microwave (VFM) radiation has been evaluated as an alternative curing method for joining composite materials. The studies showed that the required cure time of a thermosetting epoxy adhesive is substantially reduced by the use of VFM when compared to conventional (thermal) curing methods. Variable frequency microwave processing appeared to yield a slight reduction in the required adhesive cure time when compared to processing by the application of single frequency microwave radiation. In contrast to the single frequency processing, the variable frequency methodology does not readily produce localized overheating (burnt or brown spots) in the adhesive or the composite. This makes handling and location of the sample in the microwave oven less critical for producing high quality bonds and allows for a more homogeneous distribution of the cure energy. Variable frequency microwave processing is a valuable alternative method for rapidly curing thermoset adhesives at low input power levels.},
doi = {10.2172/226052},
url = {https://www.osti.gov/biblio/226052}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed May 01 00:00:00 EDT 1996},
month = {Wed May 01 00:00:00 EDT 1996}
}