NCMS PWB Surface Finishes Team project summary
- United Technologies Corp., Farmington, CT (United States). Hamilton Standard Div.
- AT and T, New York, NY (United States); and others
The NCMS PWB Surface Finishes Consortium is just about at the end of the five year program. Dozens of projects related to surface finishes and PWB solder-ability were performed by the team throughout the program, and many of them are listed in this paper. They are listed with a cross reference to where and when a technical paper was presented describing the results of the research. However, due to time and space constraints, this paper can summarize the details of only three of the major research projects accomplished by the team. The first project described is an ``Evaluation of PWB Surface Finishes.`` It describes the solderability, reliability, and wire bondability of numerous surface finishes. The second project outlined is an ``Evaluation of PWB Solderability Test Methods.`` The third project outlined is the ``Development and Evaluation of Organic Solderability Preservatives.``
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 212562
- Report Number(s):
- SAND-96-0898C; CONF-9603116-2; ON: DE96008880; TRN: AHC29608%%107
- Resource Relation:
- Conference: Institute for Interconnecting and Packaging Electronic Circuits (IPC) printed circuits expo `95, San Jose, CA (United States), 5-7 Mar 1996; Other Information: PBD: [1996]
- Country of Publication:
- United States
- Language:
- English
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