Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Patent · Tue Sep 14 00:00:00 EDT 2021

OSTI ID:1840442

Burtch, Nicholas C.

A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.

• Research Organization: Sandia National Lab. (SNL-CA), Livermore, CA (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: NA0003525
• Assignee: National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
• Patent Number(s): 11,118,249
• Application Number: 15/717,265
• OSTI ID: 1840442
• Resource Relation: Patent File Date: 09/27/2017
• Country of Publication: United States
• Language: English