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Title: Laminated magnetic materials for on-chip magnetic inductors/transformers

Patent ·
OSTI ID:1735297
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A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B601996
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
10,784,045
Application Number:
14/854,523
OSTI ID:
1735297
Resource Relation:
Patent File Date: 09/15/2015
Country of Publication:
United States
Language:
English

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