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Title: Circuit board interconnect decals

Patent ·
OSTI ID:1735148
;

A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.

Research Organization:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
NA0000622
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Number(s):
10,743,419
Application Number:
16/728,221
OSTI ID:
1735148
Resource Relation:
Patent File Date: 12/27/2019
Country of Publication:
United States
Language:
English

References (6)

Process-for forming metal micro-patterns on plastic substrate patent August 2004
Interdigitated foil interconnect for rear-contact solar cells patent-application May 2013
Backplane design for display panels and processes for their manufacture patent December 2007
Discrete die burn-in for non-packaged die patent April 1994
Method and apparatus for testing semiconductor dice patent October 2003
TAB testing of area array interconnected chips patent November 1994

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