Mechanical Integrity Issues at MCM-Cs for High Reliability Applications

Conference · Mon Apr 13 00:00:00 EDT 1998

OSTI ID:16576

Morgenstern, H A; Tarbutton, T J; Becka, G A; Uribe, F; Monroe, S; Burchett, S

During the qualification of a new high reliability low-temperature cofired ceramic (LTCC) multichip module (MCM), two issues relating to the electrical and mechanical integrity of the LTCC network were encountered while performing qualification testing. One was electrical opens after aging tests that were caused by cracks in the solder joints. The other was fracturing of the LTCC networks during mechanical testing. Through failure analysis, computer modeling, bend testing, and test samples, changes were identified. Upon implementation of all these changes, the modules passed testing, and the MCM was placed into production.

• Research Organization: Kansas City Plant, Kansas City, MO (US)
• Sponsoring Organization: US Department of Energy (US)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 16576
• Report Number(s): KCP-613-6020; ON: DE98052809; BR: DP; ON: DE98052809; BR: DP; TRN: AH200136%%703
• Resource Relation: Conference: MCM'98, International Conference and Exhibition on Multichip Modules and High Density Packaging, Denver, CO (US), 04/15/1998--04/17/1998; Other Information: Supercedes report DE98052809; PBD: 13 Apr 1998
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
AGING
CERAMICS
COMPUTERS
FRACTURING
IMPLEMENTATION
PACKAGING
PRODUCTION
RELIABILITY
TESTING