Regrowth method for fabricating wide-bandgap transistors, and devices made thereby
Patent
·
OSTI ID:1632528
Methods are provided for fabricating a HEMT (high-electron-mobility transistor) that involve sequential epitaxial growth of III-nitride channel and barrier layers, followed by epitaxial regrowth of further III-nitride material through a window in a mask layer. The regrowth takes place on the barrier layer, only in the access region or regions. Devices made according to the disclosed methods are also provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- NA0003525
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Number(s):
- 10,553,697
- Application Number:
- 16/385,193
- OSTI ID:
- 1632528
- Resource Relation:
- Patent File Date: 04/16/2019
- Country of Publication:
- United States
- Language:
- English
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