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Title: Self-alignment features for III-V ridge process and angled facet die

Patent ·
OSTI ID:1600339

A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.

Research Organization:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AR0000540
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Number(s):
10,490,971
Application Number:
15/618,958
OSTI ID:
1600339
Resource Relation:
Patent File Date: 06/09/2017
Country of Publication:
United States
Language:
English

References (13)

Surface emitting and receiving photonic device with lens patent July 2007
A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities journal November 2016
Process for forming the ridge structure of a self-aligned semiconductor laser patent October 1991
Alignment apparatus and method for aligning stacked devices patent November 2007
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension conference May 2016
Interface Between Light Source and Optical Component patent-application December 2009
Self-aligned optical waveguide to laser structure and method for making the same patent November 1993
Laser diode patent-application October 2015
Assembly of electronic and optical devices patent June 2016
Three Dimensional Self-Alignment of Flip Chip Assembly Using Solder Surface Tension During Solder Reflow patent-application September 2016
Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features patent August 2006
High reliability etched-facet photonic devices patent July 2014
Photonic chip mounting in a recess for waveguide alignment and connection patent May 2005