Multimaterial Aerosol Jet Printing of Passive Circuit Elements.

Conference · Wed Aug 01 00:00:00 EDT 2018

OSTI ID:1591720

Johannes, Seth; Keicher, D. M.; Lavin, Judith Maria; Secor, Ethan Benjamin; Whetten, Shaun R; Essien, M.

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1591720
• Report Number(s): SAND2018-9646C; 667557
• Resource Relation: Conference: Proposed for presentation at the Soild Freeform Fabrication Symposium held August 12-15, 2018 in Austin, Texas, United States.
• Country of Publication: United States
• Language: English