Electrodeposition of Nanostructured Copper on Gas Diffusion Layers as Electrocatalysts for Carbon Dioxide Reduction
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
The aim of the summer project was to immobilize copper nanostructures on gas diffusion layers to serve as electrocatalysts for the electrochemical reduction of CO2. Gas diffusion layers are typically bilayer structures consisting of a macro-porous backing material (carbon fiber paper) and a microporous, carbon-based layer (MPL). Classically, the copper catalysts are loaded on the microporous layer. Furthermore, the GDL is intrinsically hydrophobic due to polytetrafluoroethylene (PTFE)in its chemical composition, with the MPL having a more hydrophobic character due to its higher PTFE content. While beneficial for rendering the MPL impervious to electrolytes during actual CO2 reduction, the hydrophobicity precludes sufficient wetting of the MPL layer, preventing conformal, uniformly distributed and strongly adhered deposits. A two electrode electrodeposition system was used to facilitate copper deposition. An implication of this system is the inability to ascertain or accurately modulate the cathodic over-potential. Hence, galvanostatic (current control) procedures are utilized for all deposition. To improve the wetting behavior of the MPL, the surface is subjected to surface pretreatment protocols prior to electrodeposition. In addition, as morphology of deposits play a role in their efficacy as catalysts in terms of selectivity and conversion, we systematically investigate the effects of different galvanostatic deposition procedures on copper morphology.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC52-07NA27344
- OSTI ID:
- 1558873
- Report Number(s):
- LLNL-TR-787881; 983384
- Country of Publication:
- United States
- Language:
- English
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