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Title: Thermally managed LED arrays assembled by printing

Patent ·
OSTI ID:1532018

Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

Research Organization:
Univ. of Illinois at Urbana-Champaign, IL (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FG02-91ER45439
Assignee:
The Board of Trustees of the University of Illinois (Urbana, IL); Northwestern University (Evanston, IL)
Patent Number(s):
9,765,934
Application Number:
13/472,165
OSTI ID:
1532018
Resource Relation:
Patent File Date: 2012-05-15
Country of Publication:
United States
Language:
English

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Thermally Managed LED Arrays Assembled by Printing patent-application December 2012
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