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Title: Ground-referenced single-ended signaling connected graphics processing unit multi-chip module

Patent ·
OSTI ID:1531817
; ; ;

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a graphics processing cluster (GPC) chip, and an MCM package configured to include the first processor chip, the GPC chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first single-ended signaling interface circuit to the interconnect circuit. The GPC chip is configured to include a second single-ended signaling interface circuit and to execute shader programs. A second set of electrical traces fabricated within the MCM package and configured to couple the second single-ended signaling interface circuit to the interconnect circuit. In one embodiment, each single-ended signaling interface advantageously implements ground-referenced single-ended signaling.

Research Organization:
NVIDIA Corp., Santa Clara, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
B599861
Assignee:
NVIDIA Corporation (Santa Clara, CA)
Patent Number(s):
9,153,539
Application Number:
13/973,947
OSTI ID:
1531817
Resource Relation:
Patent File Date: 2013-08-22
Country of Publication:
United States
Language:
English

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