Failure Analysis and Process Verification of High Density Copper ICs Used in Multi-Chip Modules (MCM).
Conference
·
OSTI ID:1481242
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1481242
- Report Number(s):
- SAND2017-11867C; 658339
- Resource Relation:
- Conference: Proposed for presentation at the International Symposium for Testing and Failure Analysis held November 5-9, 2017 in Pasadena, CA.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Failure Analysis and Process Verification of High Density Copper ICs.
Copy of Copy of Using Cloud Constructs and Predictive Analysis to Enable Pre-Failure Process Migration in HPC Systems.
Copy of Using Cloud Constructs and Predictive Analysis to Enable Pre-Failure Process Migration in HPC Systems.
Conference
·
Fri Sep 01 00:00:00 EDT 2017
·
OSTI ID:1481242
+7 more
Copy of Copy of Using Cloud Constructs and Predictive Analysis to Enable Pre-Failure Process Migration in HPC Systems.
Conference
·
Sat May 01 00:00:00 EDT 2010
·
OSTI ID:1481242
+6 more
Copy of Using Cloud Constructs and Predictive Analysis to Enable Pre-Failure Process Migration in HPC Systems.
Conference
·
Sat May 01 00:00:00 EDT 2010
·
OSTI ID:1481242
+6 more