skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Effects of a chirped bias voltage on ion energy distributions in inductively coupled plasma reactors

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4993785· OSTI ID:1473911
ORCiD logo [1];  [2]
  1. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Chemical Engineering
  2. Univ. of Michigan, Ann Arbor, MI (United States). Dept. of Electrical Engineering and Computer Science

The metrics for controlling reactive fluxes to wafers for microelectronics processing are becoming more stringent as feature sizes continue to shrink. Recent strategies for controlling ion energy distributions to the wafer involve using several different frequencies and/or pulsed powers. Although effective, these strategies are often costly or present challenges in impedance matching. With the advent of matching schemes for wide band amplifiers, other strategies to customize ion energy distributions become available. In this study, we discuss results from a computational investigation of biasing substrates using chirped frequencies in high density, electronegative inductively coupled plasmas. Depending on the frequency range and chirp duration, the resulting ion energy distributions exhibit components sampled from the entire frequency range. However, the chirping process also produces transient shifts in the self-generated dc bias due to the reapportionment of displacement and conduction with frequency to balance the current in the system. Finally, the dynamics of the dc bias can also be leveraged towards customizing ion energy distributions.

Research Organization:
Univ. of Michigan, Ann Arbor, MI (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Fusion Energy Sciences (FES); National Science Foundation (NSF)
Grant/Contract Number:
SC0014132; PHY-1519117; CHE-1124724; SC0001319, DE-SC0014132; PHY-1519117, CHE-1124724
OSTI ID:
1473911
Alternate ID(s):
OSTI ID: 1619834
Journal Information:
Journal of Applied Physics, Vol. 122, Issue 8; ISSN 0021-8979
Publisher:
American Institute of Physics (AIP)Copyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 4 works
Citation information provided by
Web of Science

References (31)

Pulsed high-density plasmas for advanced dry etching processes
  • Banna, Samer; Agarwal, Ankur; Cunge, Gilles
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 30, Issue 4 https://doi.org/10.1116/1.4716176
journal July 2012
Ion flux and ion distribution function measurements in synchronously pulsed inductively coupled plasmas
  • Brihoum, Melisa; Cunge, Gilles; Darnon, Maxime
  • Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, Vol. 31, Issue 2 https://doi.org/10.1116/1.4790364
journal March 2013
On the possibility of making a geometrically symmetric RF-CCP discharge electrically asymmetric journal July 2008
The electrical asymmetry effect in multi-frequency capacitively coupled radio frequency discharges journal January 2011
Hybrid modelling of low temperature plasmas for fundamental investigations and equipment design journal September 2009
Control of ion energy distribution at substrates during plasma processing journal July 2000
Independent control of ion current and ion impact energy onto electrodes in dual frequency plasma devices journal February 2004
Atomic-scale silicon etching control using pulsed Cl 2 plasma
  • Petit-Etienne, Camille; Darnon, Maxime; Bodart, Paul
  • Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 31, Issue 1 https://doi.org/10.1116/1.4768717
journal January 2013
Review of inductively coupled plasmas for plasma processing journal May 1992
Controlling the shape of the ion energy distribution at constant ion flux and constant mean ion energy with tailored voltage waveforms journal February 2016
Controlling VUV photon fluxes in pulsed inductively coupled Ar/Cl 2 plasmas and potential applications in plasma etching journal January 2017
Kinetics of the deposition step in time multiplexed deep silicon etches
  • Saraf, Iqbal R.; Goeckner, Matthew J.; Goodlin, Brian E.
  • Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 31, Issue 1 https://doi.org/10.1116/1.4769873
journal January 2013
Particle-in-cell simulation of ion energy distributions on an electrode by applying tailored bias waveforms in the afterglow of a pulsed plasma journal April 2011
Numerical simulation of dual frequency etching reactors: Influence of the external process parameters on the plasma characteristics journal July 2005
Making a geometrically asymmetric capacitive rf discharge electrically symmetric journal January 2011
Study on self-bias voltage induced on the substrate by r.f. bias power in a high density plasma journal July 2003
Tailored-waveform excitation of capacitively coupled plasmas and the electrical asymmetry effect journal November 2015
Effects of rf-bias power on plasma parameters in a low gas pressure inductively coupled plasma journal February 2010
Control of ion energy distribution in low-pressure and triple-frequency capacitive discharge journal March 2009
Inductively coupled plasma etching of GaN journal August 1996
Control of ion energy distributions using a pulsed plasma with synchronous bias on a boundary electrode journal August 2011
Effect of simultaneous source and bias pulsing in inductively coupled plasma etching journal November 2009
Ion energy distributions in rf sheaths; review, analysis and simulation journal January 1999
Pulsed plasma etching for semiconductor manufacturing journal July 2014
Power coupling mode transitions induced by tailored voltage waveforms in capacitive oxygen discharges journal February 2017
RF Self-Bias Characteristics in Inductively Coupled Plasma journal December 1993
The energy distribution of ions bombarding electrode surfaces in rf plasma reactors journal February 1989
Grounded radio-frequency electrodes in contact with high density plasmas journal October 2005
Modeling and simulation of plasma etching reactors for microelectronics journal April 2000
Theory for the self-bias formation in capacitively coupled plasmas excited by arbitrary waveforms journal November 2013
Plasma etching: Yesterday, today, and tomorrow journal September 2013

Similar Records

On the scaling of rf and dc self-bias voltages with pressure in electronegative capacitively coupled plasmas
Journal Article · Thu Mar 15 00:00:00 EDT 2012 · Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films · OSTI ID:1473911

Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of low fundamental frequency biases
Journal Article · Fri Mar 29 00:00:00 EDT 2024 · Physics of Plasmas · OSTI ID:1473911

Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of ion and electron distributions on etch profiles
Journal Article · Fri Dec 30 00:00:00 EST 2022 · Journal of Vacuum Science and Technology A · OSTI ID:1473911