Reducing adhesion energy of micro-relay electrodes by ion beam synthesized oxide nanolayers

Saha, Bivas; Peschot, Alexis; Osoba, Benjamin; Ko, Changhyun; Rubin, Leonard; Liu, Tsu-Jae King; Wu, Junqiao

doi:10.1063/1.4978436

Title: Reducing adhesion energy of micro-relay electrodes by ion beam synthesized oxide nanolayers

Journal Article · Thu Mar 09 00:00:00 EST 2017 · APL Materials

DOI:https://doi.org/10.1063/1.4978436· OSTI ID:1411655

Saha, Bivas ^[1]; Peschot, Alexis ^[2]; Osoba, Benjamin ^[2];

^[3]; Rubin, Leonard ^[4]; Liu, Tsu-Jae King ^[2]; Wu, Junqiao ^[1]

Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Engineering; Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). Materials Sciences Division. Molecular Foundry
Univ. of California, Berkeley, CA (United States). Dept. of Electrical Engineering and Computer Sciences
Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Engineering
Axcelis Technologies, Beverly, MA (United States)

Reduction in the adhesion energy of contacting metal electrode surfaces in nano-electro-mechanical switches is crucial for operation with low hysteresis voltage. We demonstrate that by forming thin layers of metal-oxides on metals such as Ru and W, the adhesion energy can be reduced by up to a factor of ten. We employ a low-energy ion-beam synthesis technique and subsequent thermal annealing to form very thin layers (~2 nm) of metal-oxides (such as RuO₂ and WO_x) on Ru and W metal surfaces and quantify the adhesion energy using an atomic force microscope with microspherical tips.

View Accepted Manuscript (DOE)

Cite

Export

Save

Research Organization:: Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES); National Science Foundation (NSF)

Grant/Contract Number:: AC02-05CH11231; 0939514

OSTI ID:: 1411655

Journal Information:: APL Materials, Vol. 5, Issue 3; ISSN 2166-532X

Publisher:: American Institute of Physics (AIP)Copyright Statement

Country of Publication:: United States

Language:: English

Citation Metrics:

Cited by: 1 work

Citation information provided by
Web of Science

References (19)

Adhesion between Nanoscale Rough Surfaces Rabinovich, Yakov I.; Adler, Joshua J.; Ata, Ali Journal of Colloid and Interface Science, Vol. 232, Issue 1 https://doi.org/10.1006/jcis.2000.7167	journal	December 2000
Electrical and optical properties of reactively sputtered tungsten oxide films Miyake, K.; Kaneko, H.; Teramoto, Y. Journal of Applied Physics, Vol. 53, Issue 3 https://doi.org/10.1063/1.330649	journal	March 1982
Sub-1-volt Piezoelectric Nanoelectromechanical Relays With Millivolt Switching Capability Zaghloul, Usama; Piazza, Gianluca IEEE Electron Device Letters, Vol. 35, Issue 6, p. 669-671 https://doi.org/10.1109/led.2014.2318049	journal	June 2014
Fundamental scaling properties of electro-mechanical switches Knoll, A. W.; Grogg, D.; Despont, M. New Journal of Physics, Vol. 14, Issue 12 https://doi.org/10.1088/1367-2630/14/12/123007	journal	December 2012
Magnetic MEMS: key issues and some applications Niarchos, D. Sensors and Actuators A: Physical, Vol. 109, Issue 1-2 https://doi.org/10.1016/j.sna.2003.09.010	journal	December 2003
Fundamentals of Adhesion Lee, Lieng-Huang Springer New York, NY https://doi.org/10.1007/978-1-4899-2073-7	book	January 1991
Effect of Body Biasing on the Energy-Delay Performance of Logic Relays IEEE Electron Device Letters, Vol. 36, Issue 8 https://doi.org/10.1109/led.2015.2441116	journal	August 2015
M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures Osterberg, P. M.; Senturia, S. D. Journal of Microelectromechanical Systems, Vol. 6, Issue 2 https://doi.org/10.1109/84.585788	journal	June 1997
Force measurements with the atomic force microscope: Technique, interpretation and applications Butt, Hans-Jürgen; Cappella, Brunero; Kappl, Michael Surface Science Reports, Vol. 59, Issue 1-6 https://doi.org/10.1016/j.surfrep.2005.08.003	journal	October 2005
Characterization of Contact Resistance Stability in MEM Relays With Tungsten Electrodes Chen, Yenhao; Nathanael, Rhesa; Jeon, Jaeseok Journal of Microelectromechanical Systems, Vol. 21, Issue 3 https://doi.org/10.1109/jmems.2012.2186282	journal	June 2012
Adhesive Force Characterization for MEM Logic Relays With Sub-Micron Contacting Regions Yaung, Jack; Hutin, Louis; Jeon, Jaeseok Journal of Microelectromechanical Systems, Vol. 23, Issue 1 https://doi.org/10.1109/jmems.2013.2269995	journal	February 2014
Measuring graphene adhesion using atomic force microscopy with a microsphere tip Jiang, Tao; Zhu, Yong Nanoscale, Vol. 7, Issue 24 https://doi.org/10.1039/c5nr02480c	journal	January 2015
Adhesion effects on contact opening dynamics in micromachined switches Jensen, Brian D.; Huang, Kuangwei; Chow, Linda L. -W. Journal of Applied Physics, Vol. 97, Issue 10 https://doi.org/10.1063/1.1901837	journal	May 2005
The Effect of Atomic-Scale Roughness on the Adhesion of Nanoscale Asperities: A Combined Simulation and Experimental Investigation Jacobs, Tevis D. B.; Ryan, Kathleen E.; Keating, Pamela L. Tribology Letters, Vol. 50, Issue 1 https://doi.org/10.1007/s11249-012-0097-3	journal	February 2013
High-Quality Epitaxy of Ruthenium Dioxide, RuO ₂ , on Rutile Titanium Dioxide, TiO ₂ , by Pulsed Chemical Vapor Deposition Wang, Xinwei; Gordon, Roy G. Crystal Growth & Design, Vol. 13, Issue 3 https://doi.org/10.1021/cg301801h	journal	February 2013
Nanomechanical Switch Designs to Overcome the Surface Adhesion Energy Limit Chen, I-Ru; Qian, Chuang; Yablonovitch, Eli IEEE Electron Device Letters, Vol. 36, Issue 9 https://doi.org/10.1109/led.2015.2463119	journal	September 2015
Demonstration of Integrated Micro-Electro-Mechanical Relay Circuits for VLSI Applications Spencer, Matthew; Chen, Fred; Wang, Cheng C. IEEE Journal of Solid-State Circuits, Vol. 46, Issue 1 https://doi.org/10.1109/jssc.2010.2074370	journal	January 2011
Validity of the Rumpf and the Rabinovich adhesion force models for alumina substrates with nanoscale roughness Laitinen, O.; Bauer, K.; Niinimäki, J. Powder Technology, Vol. 246 https://doi.org/10.1016/j.powtec.2013.05.051	journal	September 2013
Ru and RuO[sub 2] as Electrical Contact Materials: Preparation and Environmental Interactions Vadimsky, R. G. Journal of The Electrochemical Society, Vol. 126, Issue 11 https://doi.org/10.1149/1.2128846	journal	January 1979

Similar Records

Hierarchically-Structured Ti/TiO₂ Electrode for Hydrogen Evolution Synthesized via 3D Printing and Anodization

Journal Article · Sat May 09 00:00:00 EDT 2020 · Journal of Energy and Power Technology · OSTI ID:1411655

Li, Xiang; Xue, Yuan; Dehoff, Ryan; +2 more

Chemical vapor deposition of ruthenium and ruthenium dioxide films

Journal Article · Fri Nov 01 00:00:00 EST 1985 · J. Electrochem. Soc.; (United States) · OSTI ID:1411655

Green, M L; Brasen, D; Gross, M E; +2 more

Nanomaterials for LightManagement in Electro-Optical Devices

Journal Article · Sun Jan 01 00:00:00 EST 2012 · Journal of Nanomaterials · OSTI ID:1411655

Truong, Vo-Van; Singh, Jai; Tanemura, Sakae; +1 more

Related Subjects

36 MATERIALS SCIENCE
adhesion
metal surfaces
atomic force microscopy
relays
metal to metal contacts

Title: Reducing adhesion energy of micro-relay electrodes by ion beam synthesized oxide nanolayers

Citation Formats

References (19)

Similar Records

Related Subjects