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Title: The role of Frenkel defect diffusion in dynamic annealing in ion-irradiated Si

Journal Article · · Scientific Reports
DOI:https://doi.org/10.1038/srep39754· OSTI ID:1410028

The formation of stable radiation damage in crystalline solids often proceeds via complex dynamic annealing processes, involving migration and interaction of ballistically-generated point defects. The dominant dynamic annealing processes, however, remain unknown even for crystalline Si. Here, we use a pulsed ion beam method to study defect dynamics in Si bombarded in the temperature range from -20 to 140 °C with 500 keV Ar ions. Results reveal a defect relaxation time constant of ~10–0.2 ms, which decreases monotonically with increasing temperature. The dynamic annealing rate shows an Arrhenius dependence with two well-defined activation energies of 73 ± 5 meV and 420 ± 10 meV, below and above 60 °C, respectively. Rate theory modeling, bench-marked against this data, suggests a crucial role of both vacancy and interstitial diffusion, with the dynamic annealing rate limited by the migration and interaction of vacancies.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-07NA27344
OSTI ID:
1410028
Report Number(s):
LLNL-JRNL-677440
Journal Information:
Scientific Reports, Vol. 7; ISSN 2045-2322
Publisher:
Nature Publishing Group
Country of Publication:
United States
Language:
English

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Cited By (3)

Impact of pre-existing disorder on radiation defect dynamics in Si journal August 2019
Radiation defect dynamics in GaAs studied by pulsed ion beams journal July 2018
Dynamic annealing in Ge studied by pulsed ion beams journal October 2017

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