Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.
Abstract
Abstract not provided.
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1377734
- Report Number(s):
- SAND2016-7951C
646656
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Conference
- Resource Relation:
- Conference: Proposed for presentation at the 18th International Conference on Metal Organic Vapor Phase Epitaxy held July 10-15, 2016 in San Diego, CA.
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Creighton, James Randall, Coltrin, Michael E., and Figiel, Jeffrey J. Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.. United States: N. p., 2016.
Web.
Creighton, James Randall, Coltrin, Michael E., & Figiel, Jeffrey J. Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.. United States.
Creighton, James Randall, Coltrin, Michael E., and Figiel, Jeffrey J. 2016.
"Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.". United States. https://www.osti.gov/servlets/purl/1377734.
@article{osti_1377734,
title = {Temperature Measurement and Thermal Modeling of Substrates Used during III-Nitride MOVPE.},
author = {Creighton, James Randall and Coltrin, Michael E. and Figiel, Jeffrey J.},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1377734},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Aug 01 00:00:00 EDT 2016},
month = {Mon Aug 01 00:00:00 EDT 2016}
}
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