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Title: Three-dimensional patterning methods and related devices

Patent ·
OSTI ID:1337625

Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.

Research Organization:
The California Institute of Technology, Pasadena, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
SC0001293; FG02-07ER46405
Assignee:
The California Institute of Technology (Pasadena, CA)
Patent Number(s):
9,530,912
Application Number:
12/956,422
OSTI ID:
1337625
Resource Relation:
Patent File Date: 2010 Nov 30
Country of Publication:
United States
Language:
English

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