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Title: Power Cycle Testing of Power Switches: A Literature Survey

Journal Article · · IEEE Transactions on Power Electronics
 [1];  [2];  [3]
  1. Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Science
  2. Univ. of Tennessee, Knoxville, TN (United States). Dept. of Electrical Engineering and Computer Scienc; Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  3. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Group

Reliability of power converters and lifetime prediction has been a major topic of research in the last few decades, especially for traction applications. The main failures in high power semiconductors are caused by thermomechanical fatigue. Power cycling and temperature cycling are the two most common thermal acceleration tests used in assessing reliability. The objective of this paper is to study the various power cycling tests found in the literature and to develop generalized steps in planning application specific power cycling tests. A comparison of different tests based on the failures, duration, test circuits, and monitored electrical parameters is presented.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Oak Ridge National Environmental Research Park
Sponsoring Organization:
USDOE; National Science Foundation (NSF)
Grant/Contract Number:
AC05-00OR22725; EEC-1041877
OSTI ID:
1325461
Journal Information:
IEEE Transactions on Power Electronics, Vol. 30, Issue 5; ISSN 0885-8993
Publisher:
IEEECopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 92 works
Citation information provided by
Web of Science