Objective for EUV microscopy, EUV lithography, and x-ray imaging
Disclosed is an imaging apparatus for EUV spectroscopy, EUV microscopy, EUV lithography, and x-ray imaging. This new imaging apparatus could, in particular, make significant contributions to EUV lithography at wavelengths in the range from 10 to 15 nm, which is presently being developed for the manufacturing of the next-generation integrated circuits. The disclosure provides a novel adjustable imaging apparatus that allows for the production of stigmatic images in x-ray imaging, EUV imaging, and EUVL. The imaging apparatus of the present invention incorporates additional properties compared to previously described objectives. The use of a pair of spherical reflectors containing a concave and convex arrangement has been applied to a EUV imaging system to allow for the image and optics to all be placed on the same side of a vacuum chamber. Additionally, the two spherical reflector segments previously described have been replaced by two full spheres or, more precisely, two spherical annuli, so that the total photon throughput is largely increased. Finally, the range of permissible Bragg angles and possible magnifications of the objective has been largely increased.
- Research Organization:
- Princeton Plasma Physics Laboratory (PPPL), Princeton, NJ (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-09CH11466
- Assignee:
- Bitter; Manfred (Princeton, NJ)
- Patent Number(s):
- 9,329,487
- Application Number:
- 14/465,404
- OSTI ID:
- 1250448
- Resource Relation:
- Patent File Date: 2014 Aug 21
- Country of Publication:
- United States
- Language:
- English
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