In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples
Abstract
The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.
- Authors:
-
- State Univ. of New York at Binghamton, Binghamton, NY (United States)
- Brookhaven National Lab. (BNL), Upton, NY (United States)
- Univ. of Massachusetts, Lowell, MA (United States)
- Publication Date:
- Research Org.:
- Brookhaven National Laboratory (BNL), Upton, NY (United States)
- Sponsoring Org.:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- OSTI Identifier:
- 1193240
- Report Number(s):
- BNL-108171-2015-JA
Journal ID: ISSN 2040-3364; NANOHL; KC040302
- Grant/Contract Number:
- SC00112704
- Resource Type:
- Journal Article: Accepted Manuscript
- Journal Name:
- Nanoscale
- Additional Journal Information:
- Journal Volume: 7; Journal Issue: 11; Journal ID: ISSN 2040-3364
- Publisher:
- Royal Society of Chemistry
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, and Gu, Zhiyong. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples. United States: N. p., 2015.
Web. doi:10.1039/c4nr06757f.
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, & Gu, Zhiyong. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples. United States. https://doi.org/10.1039/c4nr06757f
Yin, Qiyue, Stach, Eric A., Gao, Fan, Zhou, Guangwen, and Gu, Zhiyong. 2015.
"In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples". United States. https://doi.org/10.1039/c4nr06757f. https://www.osti.gov/servlets/purl/1193240.
@article{osti_1193240,
title = {In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples},
author = {Yin, Qiyue and Stach, Eric A. and Gao, Fan and Zhou, Guangwen and Gu, Zhiyong},
abstractNote = {The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.},
doi = {10.1039/c4nr06757f},
url = {https://www.osti.gov/biblio/1193240},
journal = {Nanoscale},
issn = {2040-3364},
number = 11,
volume = 7,
place = {United States},
year = {Tue Feb 10 00:00:00 EST 2015},
month = {Tue Feb 10 00:00:00 EST 2015}
}
Web of Science
Works referenced in this record:
Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures
journal, August 2013
- Li, Qingqian; Chan, Y. C.
- Journal of Alloys and Compounds, Vol. 567
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
journal, July 2007
- Laurila, T.; Mattila, T.; Vuorinen, V.
- Microelectronics Reliability, Vol. 47, Issue 7
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
journal, March 2013
- Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa
- Scripta Materialia, Vol. 68, Issue 5
Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5%Ag solders during high-temperature aging with Ni/Au metallization
journal, November 2004
- Sharif, A.; Islam, M.; Chan, Y.
- Materials Science and Engineering B, Vol. 113, Issue 3
Synthesis of Single Crystalline Tin Nanorods and Their Application as Nanosoldering Materials
journal, December 2010
- Cui, Qingzhou; Rajathurai, Karunaharan; Jia, Wenzhao
- The Journal of Physical Chemistry C, Vol. 114, Issue 50
Small particle melting of pure metals
journal, November 1986
- Allen, G. L.; Bayles, R. A.; Gile, W. W.
- Thin Solid Films, Vol. 144, Issue 2
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
journal, May 2012
- Hsiao, H. -Y.; Liu, C. -M.; Lin, H. -w.
- Science, Vol. 336, Issue 6084
Interfacial reaction of a Sn‐3.0Ag‐0.5Cu thin film during solder reflow
journal, February 2013
- Mei Lee, Liu; Haliman, Habsah; Azmin Mohamad, Ahmad
- Soldering & Surface Mount Technology, Vol. 25, Issue 1
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints
journal, November 2012
- Che, F. X.; Pang, John H. L.
- Journal of Alloys and Compounds, Vol. 541
Size-dependent melting properties of tin nanoparticles
journal, October 2006
- Jiang, Hongjin; Moon, Kyoung-sik; Dong, Hai
- Chemical Physics Letters, Vol. 429, Issue 4-6
Characterization and solderability of cold sprayed Sn–Cu coatings on Al and Cu substrates
journal, January 2010
- Li, J. F.; Agyakwa, P. A.; Johnson, C. M.
- Surface and Coatings Technology, Vol. 204, Issue 9-10
Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
journal, September 2003
- Alam, M. O.; Chan, Y. C.; Tu, K. N.
- Journal of Applied Physics, Vol. 94, Issue 6
Recent advances of nanolead-free solder material for low processing temperature interconnect applications
journal, December 2013
- Jiang, Hongjin; Moon, Kyoung-sik; Wong, C. P.
- Microelectronics Reliability, Vol. 53, Issue 12
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
journal, August 1998
- Chan, Y. C.; So, Alex C. K.; Lai, J. K. L.
- Materials Science and Engineering: B, Vol. 55, Issue 1-2
Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
journal, September 2007
- Suh, J. O.; Tu, K. N.; Tamura, N.
- Journal of Applied Physics, Vol. 102, Issue 6
Interfacial reactions between lead-free solders and common base materials
journal, March 2005
- Laurila, T.; Vuorinen, V.; Kivilahti, J. K.
- Materials Science and Engineering: R: Reports, Vol. 49, Issue 1-2
Interstitial Diffusion of Copper in Tin
journal, July 1967
- Dyson, B. F.; Anthony, T. R.; Turnbull, D.
- Journal of Applied Physics, Vol. 38, Issue 8
Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow
journal, March 2002
- Ma, D.; Wang, W. D.; Lahiri, S. K.
- Journal of Applied Physics, Vol. 91, Issue 5
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
journal, June 1996
- Kim, H. K.; Tu, K. N.
- Physical Review B, Vol. 53, Issue 23
Intrinsic and Interdiffusion in Cu-Sn System
journal, May 2011
- Kumar, Santosh; Handwerker, Carol A.; Dayananda, Mysore A.
- Journal of Phase Equilibria and Diffusion, Vol. 32, Issue 4
The Impact of Nanocontact on Nanowire Based Nanoelectronics
journal, October 2008
- Lin, Yen-Fu; Jian, Wen-Bin
- Nano Letters, Vol. 8, Issue 10
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging
journal, February 2005
- Islam, M. N.; Sharif, Ahmed; Chan, Y. C.
- Journal of Electronic Materials, Vol. 34, Issue 2
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
journal, February 2011
- Li, J. F.; Agyakwa, P. A.; Johnson, C. M.
- Acta Materialia, Vol. 59, Issue 3
Interdiffusion and reaction in bimetallic Cu-Sn thin films
journal, April 1973
- Tu, K. N.
- Acta Metallurgica, Vol. 21, Issue 4
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
journal, November 2003
- Yoon, Jeong-Won; Lee, Chang-Bae; Jung, Seung-Boo
- Journal of Electronic Materials, Vol. 32, Issue 11
On the mechanism of the binary Cu/Sn solder reaction
journal, January 2005
- Görlich, J.; Schmitz, G.; Tu, K. N.
- Applied Physics Letters, Vol. 86, Issue 5
Microstructure and Interdiffusion of Template-Synthesized Au/Sn/Au Junction Nanowires
journal, July 2004
- Wang, Jin-Guo; Tian, Ming-Liang; Mallouk, Thomas E.
- Nano Letters, Vol. 4, Issue 7
Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions
journal, March 2007
- Labie, Riet; Ruythooren, Wouter; Van Humbeeck, Jan
- Intermetallics, Vol. 15, Issue 3
Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
journal, July 2012
- Yu, Chi-Yang; Chen, Wei-Yu; Duh, Jenq-Gong
- Intermetallics, Vol. 26
A review: On the development of low melting temperature Pb-free solders
journal, June 2014
- Kotadia, Hiren R.; Howes, Philip D.; Mannan, Samjid H.
- Microelectronics Reliability, Vol. 54, Issue 6-7
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
journal, November 2009
- Yoon, Jeong-Won; Noh, Bo-In; Kim, Bong-Kyun
- Journal of Alloys and Compounds, Vol. 486, Issue 1-2
The Cu-Sn (Copper-Tin) system
journal, June 1990
- Saunders, N.; Miodownik, A. P.
- Bulletin of Alloy Phase Diagrams, Vol. 11, Issue 3
The Cu–Sn phase diagram part II: New thermodynamic assessment
journal, March 2013
- Li, D.; Franke, P.; Fürtauer, S.
- Intermetallics, Vol. 34
Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems
journal, June 2009
- Cui, Qingzhou; Gao, Fan; Mukherjee, Subhadeep
- Small, Vol. 5, Issue 11
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
journal, July 2007
- Jee, Y. K.; Ko, Y. H.; Yu, Jin
- Journal of Materials Research, Vol. 22, Issue 7
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
journal, May 2007
- Chao, Brook; Chae, Seung-Hyun; Zhang, Xuefeng
- Acta Materialia, Vol. 55, Issue 8
Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements
journal, July 1996
- Lai, S. L.; Guo, J. Y.; Petrova, V.
- Physical Review Letters, Vol. 77, Issue 1
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
journal, December 2007
- Peng, Weiqun; Monlevade, Eduardo; Marques, Marco E.
- Microelectronics Reliability, Vol. 47, Issue 12
Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying
journal, April 2003
- Lai, H. L.; Duh, J. G.
- Journal of Electronic Materials, Vol. 32, Issue 4
Fast Diffusion and Void Formation in a Two-Segment Copper-Tin Lead-Free Nanowire System with One-Dimensional Confinement
journal, August 2012
- Gao, Fan; Liu, Zhenyu; Zhou, Guangwen
- Science of Advanced Materials, Vol. 4, Issue 8
Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder
journal, January 2009
- Peng, Yong; Cullis, Tony; Inkson, Beverley
- Nano Letters, Vol. 9, Issue 1
Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface
journal, July 2003
- Ma, Xin; Wang, Fengjiang; Qian, Yiyu
- Materials Letters, Vol. 57, Issue 22-23
Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates
journal, January 2011
- Huang, T. S.; Tseng, H. W.; Hsiao, Y. H.
- Electrochemical and Solid-State Letters, Vol. 14, Issue 10
Kinetics of the η–η′ transformation in Cu6Sn5
journal, November 2011
- Nogita, K.; Gourlay, C. M.; McDonald, S. D.
- Scripta Materialia, Vol. 65, Issue 10
Synthesis, Characterization, and Thermal Properties of Nanoscale Lead-Free Solders on Multisegmented Metal Nanowires
journal, May 2009
- Gao, Fan; Mukherjee, Subhadeep; Cui, Qingzhou
- The Journal of Physical Chemistry C, Vol. 113, Issue 22
Works referencing / citing this record:
The Effects of Boron Minerals on the Microstructure and Abrasion Resistance of Babbitt Metal (Sn–Sb–Cu) Used as Coating Materials in Hydroelectric Power Plants
journal, August 2019
- Tasgin, Yahya
- International Journal of Metalcasting, Vol. 14, Issue 1
Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film
journal, October 2019
- Choi, Dahyun; Kang, Suhee; Kim, Hyungsub
- Journal of Nanomaterials, Vol. 2019
In situ imaging of the soldering reactions in nanoscale Cu/Sn/Cu and Sn/Cu/Sn diffusion couples
journal, January 2018
- Yin, Qiyue; Gao, Fan; Gu, Zhiyong
- Journal of Applied Physics, Vol. 123, Issue 2