Vehicle drive module having improved cooling configuration
An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
- Research Organization:
- Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC02-99EE50571
- Assignee:
- Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
- Patent Number(s):
- 7,177,153
- Application Number:
- 10/252,317
- OSTI ID:
- 1176107
- Resource Relation:
- Patent File Date: 2002 Dec 09
- Country of Publication:
- United States
- Language:
- English
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