U.S. Department of EnergyOffice of Scientific and Technical Information
Single level microelectronic device package with an integral window
Abstract
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.
- Inventors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1174618
- Patent Number(s):
- 6,661,084
- Application Number:
- 10/083,454
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Peterson, Kenneth A., and Watson, Robert D. Single level microelectronic device package with an integral window. United States: N. p., 2003.
Web.
Peterson, Kenneth A., & Watson, Robert D. Single level microelectronic device package with an integral window. United States.
Peterson, Kenneth A., and Watson, Robert D. 2003.
"Single level microelectronic device package with an integral window". United States. https://www.osti.gov/servlets/purl/1174618.
@article{osti_1174618,
title = {Single level microelectronic device package with an integral window},
author = {Peterson, Kenneth A. and Watson, Robert D.},
abstractNote = {A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.},
doi = {},
url = {https://www.osti.gov/biblio/1174618},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 09 00:00:00 EST 2003},
month = {Tue Dec 09 00:00:00 EST 2003}
}