Solder Interconnect Predictor (SIP) Solder Fatigue Software.
Conference
·
OSTI ID:1142781
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1142781
- Report Number(s):
- SAND2008-6469C; 508909
- Resource Relation:
- Conference: Proposed for presentation at the Lockheed Martin Mechanical Analysis Conference MAC08 held October 21-23, 2008 in Orlando, FL.
- Country of Publication:
- United States
- Language:
- English
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