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Title: Effect of Base Material and Plating Layers on the Mechanical Strength of Au-Sn Solder Bonds.

Conference ·
OSTI ID:1142490

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1142490
Report Number(s):
SAND2008-7431C; 508599
Resource Relation:
Conference: Proposed for presentation at the Inter. Brazing and Soldering Conference 2009 held April 26-29, 2009 in Orlando, FL.
Country of Publication:
United States
Language:
English