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Title: Electromagnetic Isolation Solutions in Low Temperature Cofired Ceramic (LTCC)

Conference · · Proceedings of the 2011 International Symposium on Microelectronics
OSTI ID:1134032

Low Temperature Cofired Ceramic (LTCC) is a commercial ceramic-glass multilayer technology with compelling advantages for microelectronics, microsystems and sensors. High frequency applications require good electrical properties such as low dielectric loss and newer applications require extreme isolation from electromagnetic interference (EMI) that is even difficult to measure (-150db). Approaches to providing this isolation, once provided by via fences, have included sidewall coating and full tape thickness features (FTTF) that have been introduced by the filling of slots with via-fill compositions. Several techniques for creating these structures have been modeled for stress and temperature effects in the face of other necessary attachments, such as metallic seal frames. The relative effects of attachment media, FTTF geometry, and alternative measures will be reported. Approaches for thick film and thin film implementations are described.

Research Organization:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
DE-NA-0000622
OSTI ID:
1134032
Report Number(s):
KCP-613-9003
Journal Information:
Proceedings of the 2011 International Symposium on Microelectronics, Conference: 44th International Symposium on Microelectronics
Country of Publication:
United States
Language:
English

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