Compositions and methods for adoptive and active immunotherapy
Patent
·
OSTI ID:1117675
Modular aAPCs and methods of their manufacture and use are provided. The modular aAPCs are constructed from polymeric microparticles. The aAPCs include encapsulated cytokines and coupling agents which modularly couple functional elements including T cell receptor activators, co-stimulatory molecules and adhesion molecules to the particle. The ability of these aAPCs to release cytokines in a controlled manner, coupled with their modular nature and ease of ligand attachment, results in an ideal, tunable APC capable of stimulating and expanding primary T cells.
- Research Organization:
- ORISE (Oak Ridge Institute for Science and Education (ORISE), Oak Ridge, TN (United States))
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC05-06OR23100
- Assignee:
- Yale University (New Haven, CT)
- Patent Number(s):
- 8,629,098
- Application Number:
- 12/812,304
- OSTI ID:
- 1117675
- Resource Relation:
- Patent File Date: 2009 Jul 30
- Country of Publication:
- United States
- Language:
- English
Similar Records
A novel system of artificial antigen-presenting cells efficiently stimulates Flu peptide-specific cytotoxic T cells in vitro
Staphylococcal enterotoxin C2 stimulated the maturation of bone marrow derived dendritic cells via TLR-NFκB signaling pathway
Tumor necrosis factor beta and ultraviolet radiation are potent regulators of human keratinocyte ICAM-1 expression
Journal Article
·
Fri Aug 05 00:00:00 EDT 2011
· Biochemical and Biophysical Research Communications
·
OSTI ID:1117675
+7 more
Staphylococcal enterotoxin C2 stimulated the maturation of bone marrow derived dendritic cells via TLR-NFκB signaling pathway
Journal Article
·
Sat Sep 15 00:00:00 EDT 2018
· Experimental Cell Research
·
OSTI ID:1117675
+4 more
Tumor necrosis factor beta and ultraviolet radiation are potent regulators of human keratinocyte ICAM-1 expression
Journal Article
·
Wed Aug 01 00:00:00 EDT 1990
· Journal of Investigative Dermatology; (USA)
·
OSTI ID:1117675
+6 more