Encapsulation methods for organic electrical devices
Patent
·
OSTI ID:1084088
The disclosure provides methods and materials suitable for use as encapsulation barriers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device encapsulated by alternating layers of a silicon-containing bonding material and a ceramic material. The encapsulation methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
- Research Organization:
- National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-06NT42936
- Assignee:
- SRI International (Menlo Park, CA)
- Patent Number(s):
- 8,466,011
- Application Number:
- 13/202,062
- OSTI ID:
- 1084088
- Country of Publication:
- United States
- Language:
- English
Similar Records
Encapsulation methods and dielectric layers for organic electrical devices
Light emitting ceramic device and method for fabricating the same
Challenges in Nanoelectronics - Gate Dielectrics and Device Modeling (invited)
Patent
·
Tue Jul 02 00:00:00 EDT 2013
·
OSTI ID:1084088
+1 more
Light emitting ceramic device and method for fabricating the same
Patent
·
Tue Nov 30 00:00:00 EST 2004
·
OSTI ID:1084088
+5 more
Challenges in Nanoelectronics - Gate Dielectrics and Device Modeling (invited)
Journal Article
·
Sat Jan 01 00:00:00 EST 2005
· Journal of Physics Conference Series
·
OSTI ID:1084088