Evaluation of low-residue soldering for military and commercial applications: A report from the Low-Residue Soldering Task Force
- Sandia National Labs., Albuquerque, NM (United States)
- SEHO (United States); and others
The LRSTF combined the efforts of industry, military, and government to evaluate low-residue soldering processes for military and commercial applications. These processes were selected for evaluation because they provide a means for the military to support the presidential mandate while producing reliable hardware at a lower cost. This report presents the complete details and results of a testing program conducted by the LRSTF to evaluate low-residue soldering for printed wiring assemblies. A previous informal document provided details of the test plan used in this evaluation. Many of the details of that test plan are contained in this report. The test data are too massive to include in this report, however, these data are available on disk as Excel spreadsheets upon request. The main purpose of low-residue soldering is to eliminate waste streams during the manufacturing process.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 106617
- Report Number(s):
- SAND-95-1060; ON: DE96000056; TRN: AHC29525%%118
- Resource Relation:
- Other Information: PBD: Jun 1995
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
PRINTED CIRCUITS
SOLDERING
INDUSTRIAL PLANTS
WASTE MANAGEMENT
METALLURGICAL FLUX
MATERIAL SUBSTITUTION
MILITARY EQUIPMENT
PERFORMANCE TESTING
CLEANING
MANUFACTURING
PERFORMANCE
EXPERIMENTAL DATA
CORROSIVE EFFECTS