Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

Patent · Tue Jul 12 00:00:00 EDT 2011

OSTI ID:1021903

Lin, YuPo J ^[1]; Henry, Michael P ^[2]; Snyder, Seth W ^[3]

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1. Naperville, IL
2. Batavia, IL
3. Lincolnwood, IL

An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-31-109-ENG-38
• Assignee: UChicago Argonne, LLC (Chicago, IL)
• Patent Number(s): 7,977,395
• Application Number: 12/288,554
• OSTI ID: 1021903
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE