Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s
Conference
·
OSTI ID:10178354
The progress made in advanced packaging development at Sandia National Laboratories for integration of III-V photonic devices and CMOS IC`s on Silicon MCM substrates for planar aid stacked applications will be reported. Studies to characterize precision alignment techniques using solder attach materials compatible with both silicon IC`s and III-V devices will be discussed. Examples of the use of back-side alignment and IR through-wafer inspection will be shown along with the extra processing steps that are used. Under bump metallurgy considerations are also addressed.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10178354
- Report Number(s):
- SAND-93-1773C; CONF-9307112-1-Vugraphs; ON: DE93017894
- Resource Relation:
- Conference: International workshop on optoelectronic packaging science,Santa Barbara, CA (United States),28 Jul 1993; Other Information: PBD: [1993]
- Country of Publication:
- United States
- Language:
- English
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