Encapsulant materials and associated devices
Patent
·
OSTI ID:1016539
- Littleton, CO
- Lima, OH
Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.
- Research Organization:
- BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC36-99GO10337
- Assignee:
- BRP Manufacturing Company (Lima, OH); Alliance For Sustainable Energy, LLC (Golden, CO)
- Patent Number(s):
- 7,902,301
- Application Number:
- US Patent Application 12/131,211
- OSTI ID:
- 1016539
- Country of Publication:
- United States
- Language:
- English
Moisture transport, adhesion, and corrosion protection of PV module packaging materials
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journal | October 2006 |
Modeling of rates of moisture ingress into photovoltaic modules
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journal | October 2006 |
Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices
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journal | February 2007 |
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