Boron diffusion in silicon devices
Patent
·
OSTI ID:1014672
- Atlanta, GA
- Smyrna, GA
- Stockbridge, GA
Disclosed are various embodiments that include a process, an arrangement, and an apparatus for boron diffusion in a wafer. In one representative embodiment, a process is provided in which a boric oxide solution is applied to a surface of the wafer. Thereafter, the wafer is subjected to a fast heat ramp-up associated with a first heating cycle that results in a release of an amount of boron for diffusion into the wafer.
- Research Organization:
- Georgia Institute of Technology, Atlanta, GA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC36-00GO10600
- Assignee:
- Georgia Tech Research Corporation (Atlanta, GA)
- Patent Number(s):
- 7,790,574
- Application Number:
- US Patent Application 11/301,527
- OSTI ID:
- 1014672
- Country of Publication:
- United States
- Language:
- English
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