Hardness variability in commercial and hardened technologies
Abstract
Over the past 10 years, there have been a number of advances in methods to assess and assure the radiation hardness of microelectronics in military and space applications. At the forefront of these is the Qualified Manufacturers List (QML) methodology, in which the hardness of product is ``built-in`` through statistical process control (SPC) of technology parameters relevant to the radiation response, test structure to integrated circuit (IC) correlations, and techniques for extrapolating laboratory test results to varying radiation scenarios. At the same time, there has been renewed interest in the use of commercial technology -- with its enhanced performance, reduced cost, and higher reliability -- in military and space systems. In this paper, we initially demonstrate the application of QML techniques to assure and control the radiation response of hardened technologies. Through several examples, we demonstrate intra-die, wafer-to-wafer, and lot-to-lot variations in a hardened technology. We observe 10 to 30% variations in key technology parameters that result from variability in geometry, process, and design layout. Radiation-induced degradation is seen to mirror preirradiation characteristics. We then evaluate commercial technologies and report considerably higher variability in radiation hardness, i.e., variations by a factor of two to five. This variability is shown tomore »
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States); Defense Nuclear Agency, Washington, DC (United States)
- OSTI Identifier:
- 10128251
- Report Number(s):
- SAND-94-0532C; CONF-940726-1
ON: DE94007270; BR: GB0103012
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Conference
- Resource Relation:
- Conference: 31. annual international nuclear and space radiation effects conference,Tucson, AZ (United States),18-22 Jul 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; RADIATION HARDENING; EVALUATION; COBALT 60; RADIATION DOSES; SILICON; 440200; 360605; RADIATION EFFECTS ON INSTRUMENT COMPONENTS, INSTRUMENTS, OR ELECTRONIC SYSTEMS; RADIATION EFFECTS
Citation Formats
Shaneyfelt, M R, Winokur, P S, Meisenheimer, T L, Sexton, F W, Roeske, S B, and Knoll, M G. Hardness variability in commercial and hardened technologies. United States: N. p., 1994.
Web.
Shaneyfelt, M R, Winokur, P S, Meisenheimer, T L, Sexton, F W, Roeske, S B, & Knoll, M G. Hardness variability in commercial and hardened technologies. United States.
Shaneyfelt, M R, Winokur, P S, Meisenheimer, T L, Sexton, F W, Roeske, S B, and Knoll, M G. 1994.
"Hardness variability in commercial and hardened technologies". United States. https://www.osti.gov/servlets/purl/10128251.
@article{osti_10128251,
title = {Hardness variability in commercial and hardened technologies},
author = {Shaneyfelt, M R and Winokur, P S and Meisenheimer, T L and Sexton, F W and Roeske, S B and Knoll, M G},
abstractNote = {Over the past 10 years, there have been a number of advances in methods to assess and assure the radiation hardness of microelectronics in military and space applications. At the forefront of these is the Qualified Manufacturers List (QML) methodology, in which the hardness of product is ``built-in`` through statistical process control (SPC) of technology parameters relevant to the radiation response, test structure to integrated circuit (IC) correlations, and techniques for extrapolating laboratory test results to varying radiation scenarios. At the same time, there has been renewed interest in the use of commercial technology -- with its enhanced performance, reduced cost, and higher reliability -- in military and space systems. In this paper, we initially demonstrate the application of QML techniques to assure and control the radiation response of hardened technologies. Through several examples, we demonstrate intra-die, wafer-to-wafer, and lot-to-lot variations in a hardened technology. We observe 10 to 30% variations in key technology parameters that result from variability in geometry, process, and design layout. Radiation-induced degradation is seen to mirror preirradiation characteristics. We then evaluate commercial technologies and report considerably higher variability in radiation hardness, i.e., variations by a factor of two to five. This variability is shown to arise from a lack of control of technology parameters relevant to the radiation response, which a commercial manufacturer has no interest in controlling in a normal process flow.},
doi = {},
url = {https://www.osti.gov/biblio/10128251},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 01 00:00:00 EST 1994},
month = {Tue Mar 01 00:00:00 EST 1994}
}