skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: HF-based etching processes for improving laser damage resistance of fused silica optical surfaces

Journal Article · · Journal of the American Ceramic Society
OSTI ID:1010834

The effect of various HF-based etching processes on the laser damage resistance of scratched fused silica surfaces has been investigated. Conventionally polished and subsequently scratched fused silica plates were treated by submerging in various HF-based etchants (HF or NH{sub 4}F:HF at various ratios and concentrations) under different process conditions (e.g., agitation frequencies, etch times, rinse conditions, and environmental cleanliness). Subsequently, the laser damage resistance (at 351 or 355 nm) of the treated surface was measured. The laser damage resistance was found to be strongly process dependent and scaled inversely with scratch width. The etching process was optimized to remove or prevent the presence of identified precursors (chemical impurities, fracture surfaces, and silica-based redeposit) known to lead to laser damage initiation. The redeposit precursor was reduced (and hence the damage threshold was increased) by: (1) increasing the SiF{sub 6}{sup 2-} solubility through reduction in the NH4F concentration and impurity cation impurities, and (2) improving the mass transport of reaction product (SiF{sub 6}{sup 2-}) (using high frequency ultrasonic agitation and excessive spray rinsing) away from the etched surface. A 2D finite element crack-etching and rinsing mass transport model (incorporating diffusion and advection) was used to predict reaction product concentration. The predictions are consistent with the experimentally observed process trends. The laser damage thresholds also increased with etched amount (up to {approx}30 {micro}m), which has been attributed to: (1) etching through lateral cracks where there is poor acid penetration, and (2) increasing the crack opening resulting in increased mass transport rates. With the optimized etch process, laser damage resistance increased dramatically; the average threshold fluence for damage initiation for 30 {micro}m wide scratches increased from 7 to 41 J/cm{sup 2}, and the statistical probability of damage initiation at 12 J/cm{sup 2} of an ensemble of scratches decreased from {approx}100 mm{sup -1} of scratch length to {approx}0.001 mm{sup -1}.

Research Organization:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
1010834
Report Number(s):
LLNL-JRNL-425118; JACTAW; TRN: US201108%%537
Journal Information:
Journal of the American Ceramic Society, Vol. 94, Issue 2; ISSN 0002-7820
Country of Publication:
United States
Language:
English

Similar Records

Modeling Wet Chemical Etching of Surface Flaws on Fused Silica
Conference · Wed Oct 28 00:00:00 EDT 2009 · OSTI ID:1010834

Thermal annealing of laser damage precursors on fused silica surfaces
Journal Article · Mon Mar 19 00:00:00 EDT 2012 · Optics Express · OSTI ID:1010834

Sub-surface mechanical damage distributions during grinding of fused silica
Journal Article · Mon Nov 28 00:00:00 EST 2005 · Journal of Non-Crystalline Solids, vol. 352, N/A, October 30, 2006, pp. 5601-5617 · OSTI ID:1010834