High-performance GaAs/AlGaAs optical modulators: Their performance and packaging for microwave photonic integrated circuits
- and others
The goal of this effort is to build and package photonic integrated circuits (PICs). This infers that compact device design is very important, with all building blocks of the circuit aimed toward integration, low voltage operation, and manufacturability. With such a device, it is important that optical packaging by considered in the initial design. To this end, an advanced photonic packaging concept was designed. This concept employs vertical coupling of light both in and out of the package. This package concept is aimed at hermeticity, with no fiber penetrations through the walls of the package. This paper will describe the building blocks of this package, including output gratings, binary optics, and an automatic fiber capture device, called CLASP.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10106666
- Report Number(s):
- SAND-94-2531C; CONF-941247-1; ON: DE95004533; BR: GB0103012; TRN: AHC29505%%104
- Resource Relation:
- Conference: 1994 Asia-Pacific microwave conference,Tokyo (Japan),6-9 Dec 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
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