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  1. Vapor phase XeF{sub 2} has been used in the fabrication of various types of devices including MEMS, resonators, RF switches, and micro-fluidics, and for wafer level packaging. In this presentation we demonstrate the use of XeF{sub 2} Si etch in conjunction with deep reactive ion etch (DRIE) to release single crystal Si structures on Silicon On Insulator (SOI) wafers. XeF{sub 2} vapor phase etching is conducive to the release of movable SOI structures due to the isotropy of the etch, the high etch selectivity to silicon dioxide (SiO{sub 2}) and fluorocarbon (FC) polymer etch masks, and the ability to undercutmore » large structures at high rates. Also, since XeF{sub 2} etching is a vapor phase process, stiction problems often associated with wet chemical release processes are avoided. Monolithic single crystal Si features were fabricated by etching continuous trenches in the device layer of an SOI wafer using a DRIE process optimized to stop on the buried SiO{sub 2}. The buried SiO{sub 2} was then etched to handle Si using an anisotropic plasma etch process. The sidewalls of the device Si features were then protected with a conformal passivation layer of either FC polymer or SiO{sub 2}. FC polymer was deposited from C4F8 gas precursor in an inductively coupled plasma reactor, and SiO{sub 2} was deposited by plasma enhanced chemical vapor deposition (PECVD). A relatively high ion energy, directional reactive ion etch (RIE) plasma was used to remove the passivation film on surfaces normal to the direction of the ions while leaving the sidewall passivation intact. After the bottom of the trench was cleared to the underlying Si handle wafer, XeF{sub 2} was used to isotropically etch the handle Si, thus undercutting and releasing the features patterned in the device Si layer. The released device Si structures were not etched by the XeF{sub 2} due to protection from the top SiO{sub 2} mask, sidewall passivation, and the buried SiO{sub 2} layer. Optimization of the XeF{sub 2} process and the sidewall passivation layers will be discussed. The advantages of releasing SOI devices with XeF{sub 2} include avoiding stiction, maintaining the integrity of the buried SiO{sub 2}, and simplifying the fabrication flow for thermally actuated devices.« less
  2. Abstract not provided.
  3. This report represents the completion of a Laboratory-Directed Research and Development (LDRD) program to develop and fabricate geometric test structures for the measurement of transport properties in bulk GaN and AlGaN/GaN heterostructures. A large part of this study was spent examining fabrication issues related to the test structures used in these measurements, due to the fact that GaN processing is still in its infancy. One such issue had to do with surface passivation. Test samples without a surface passivation, often failed at electric fields below 50 kV/cm, due to surface breakdown. A silicon nitride passivation layer of approximately 200 nmmore » was used to reduce the effects of surface states and premature surface breakdown. Another issue was finding quality contacts for the material, especially in the case of the AlGaN/GaN heterostructure samples. Poor contact performance in the heterostructures plagued the test structures with lower than expected velocities due to carrier injection from the contacts themselves. Using a titanium-rich ohmic contact reduced the contact resistance and stopped the carrier injection. The final test structures had an etch constriction with varying lengths and widths (8x2, 10x3, 12x3, 12x4, 15x5, and 16x4 {micro}m) and massive contacts. A pulsed voltage input and a four-point measurement in a 50 {Omega} environment was used to determine the current through and the voltage dropped across the constriction. From these measurements, the drift velocity as a function of the applied electric field was calculated and thus, the velocity-field characteristics in n-type bulk GaN and AlGaN/GaN test structures were determined. These measurements show an apparent saturation velocity near to 2.5x10{sup 7} cm/s at 180 kV/cm and 3.1x10{sup 7} cm/s, at a field of 140 kV/cm, for the bulk GaN and AlGaN heterostructure samples, respectively. These experimental drift velocities mark the highest velocities measured in these materials to date and confirm the predictions of previous theoretical models using ensemble Monte Carlo simulations.« less
  4. Using a two-step method of plasma and wet chemical etching, we demonstrate smooth, vertical facets for use in Al{sub x} Ga{sub 1-x} N-based deep-ultraviolet laser-diode heterostructures where x = 0 to 0.5. Optimization of plasma-etching conditions included increasing both temperature and radiofrequency (RF) power to achieve a facet angle of 5 deg from vertical. Subsequent etching in AZ400K developer was investigated to reduce the facet surface roughness and improve facet verticality. The resulting combined processes produced improved facet sidewalls with an average angle of 0.7 deg from vertical and less than 2-nm root-mean-square (RMS) roughness, yielding an estimated reflectivity greatermore » than 95% of that of a perfectly smooth and vertical facet.« less
  5. Abstract not provided.
  6. The goal of this one year LDRD was to improve the overall efficiency of InGaN LEDs by improving the extraction of light from the semiconductor chip. InGaN LEDs are currently the most promising technology for producing high efficiency blue and green semiconductor light emitters. Improving the efficiency of InGaN LEDs will enable a more rapid adoption of semiconductor based lighting. In this LDRD, we proposed to develop photonic structures to improve light extraction from nitride-based light emitting diodes (LEDs). While many advanced device geometries were considered for this work, we focused on the use of a photonic crystal for improvedmore » light extraction. Although resonant cavity LEDs and other advanced structures certainly have the potential to improve light extraction, the photonic crystal approach showed the most promise in the early stages of this short program. The photonic crystal (PX)-LED developed here incorporates a two dimensional photonic crystal, or photonic lattice, into a nitride-based LED. The dimensions of the photonic crystal are selected such that there are very few or no optical modes in the plane of the LED ('lateral' modes). This will reduce or eliminate any radiation in the lateral direction so that the majority of the LED radiation will be in vertical modes that escape the semiconductor, which will improve the light-extraction efficiency. PX-LEDs were fabricated using a range of hole diameters and lattice constants and compared to control LEDs without a photonic crystal. The far field patterns from the PX-LEDs were dramatically modified by the presence of the photonic crystal. An increase in LED brightness of 1.75X was observed for light measured into a 40 degree emission cone with a total increase in power of 1.5X for an unencapsulated LED.« less
  7. The room-temperature velocity-field characteristics for n-type gallium nitride and AlGaN/GaN heterostructures, grown epitaxially on sapphire, were determined experimentally. A pulsed voltage input and four-point measurements were used on special geometry samples to determine the electron drift velocity as a function of applied electric field in the basal plane. These measurements show apparent saturation velocities near 2.5 x 10{sup 7} cm/s at 180 kV/cm for the n-type gallium nitride and 3.1 x 10{sup 7} cm/s at 140 kV/cm for the AlGaN/GaN heterostructures. A comparison of these studies shows that the experimental velocities are close to previously published simulations based upon Montemore » Carlo techniques.« less
  8. Abstract not provided.
  9. Abstract not provided.
  10. Sandia National Labs has developed an autonomous, hand-held system for sensitive/selective detection of gas-phase chemicals. Through the sequential connection of microfabricated preconcentrators (PC), gas chromatography columns (GC) and a surface acoustic wave (SAW) detector arrays, the MicroChemLab{trademark} system is capable of selective and sensitive chemical detection in real-world environments. To date, interconnection of these key components has primarily been achieved in a hybrid fashion on a circuit board modified to include fluidic connections. The monolithic integration of the PC and GC with a silicon-based acoustic detector is the subject of this work.

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"Shul, Randy John"

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