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  1. Inductively Coupled Plasma Etching of InP with Cl2/H2/Ar Plasma.

    Abstract not provided.
  2. Inductively Coupled Plasma Etching of Benzocyclobutene with SF6 Chemistry.

    Abstract not provided.
  3. Characterization of SOI MEMS Sidewall Roughness.

    Abstract not provided.
  4. CHARACTERIZATION OF SOI MEMS SIDEWALL ROUGHNESS.

    Abstract not provided.
  5. Low temperature deep reactive ion etching :

    Abstract not provided.
  6. Hermetic Wafer-Level Packaging for RF MEMs: Effects on Resonator Performance.

    Abstract not provided.
  7. Hermetic Wafer-Level Packaging for RF MEMs: Effects on Resonator Performance.

    Abstract not provided.
  8. High precision fabrication of polarization insensitive resonant grating filters.

    Abstract not provided.
  9. A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.

    Abstract not provided.
  10. A New Wafer-Level Packaging Technology for MEMS with Hermetic Micro-Environment.

    Abstract not provided.
...

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"Shul, Randy John"

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