skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information
  1. Compact radiation detector

    An apparatus for detecting radiation is provided. In embodiments, at least one sensor is disposed on a surface of a wafer-like substrate. At least one sensor medium is fixed relative to the substrate, optically or electrically coupled to the sensor, and separated from the sensor by no more than the substrate thickness. An electronic signal-processing circuit is connected to the sensor and configured to produce an output when the sensor is stimulated by a product of an interaction between the sensor medium and impinging radiation. The sensor is configured to collect, from the sensor medium, charge and/or light produced withinmore » the sensor medium by interactions with impinging radiation.« less
  2. Multiple-mode radiation detector

    An apparatus for detecting radiation is provided. In embodiments, at least one sensor medium is provided, of a kind that interacts with radiation to generate photons and/or charge carriers. The apparatus also includes at least one electrode arrangement configured to collect radiation-generated charge from a sensor medium that has been provided. The apparatus also includes at least one photodetector configured to produce an electrical output in response to photons generated by radiation in such a sensor medium, and an electronic circuit configured to produce an output that is jointly responsive to the collected charge and to the photodetector output. Atmore » least one such electrode arrangement, at least one such photodetector, and at least one such sensor medium are combined to form an integral unit.« less
  3. An overview of the Ultra-Fast X-ray Imager (UXI) program at Sandia Labs.

    Abstract not provided.
  4. Focal plane array with modular pixel array components for scalability

    A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitchmore » is preserved across the enlarged pixel array.« less
  5. Direct Detection of > 15 keV X-ray Photons on a Hybrid-CMOS Imager.

    Abstract not provided.
  6. An overview of the Ultra-Fast X-ray Imager (UXI) program at Sandia Labs.

    Abstract not provided.
  7. Smart trigger logic for focal plane arrays

    An electronic device includes a memory configured to receive data representing light intensity values from pixels in a focal plane array and a processor that analyzes the received data to determine which light values correspond to triggered pixels, where the triggered pixels are those pixels that meet a predefined set of criteria, and determines, for each triggered pixel, a set of neighbor pixels for which light intensity values are to be stored. The electronic device also includes a buffer that temporarily stores light intensity values for at least one previously processed row of pixels, so that when a triggered pixelmore » is identified in a current row, light intensity values for the neighbor pixels in the previously processed row and for the triggered pixel are persistently stored, as well as a data transmitter that transmits the persistently stored light intensity values for the triggered and neighbor pixels to a data receiver.« less
  8. MBE and Material Characteristics of T2SL.

    Abstract not provided.
...

Search for:
All Records
Creator / Author
"Kay, Randolph R."

Refine by:
Resource Type
Availability
Publication Date
Creator / Author
Research Organization