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Title: Modular jet impingement assemblies with passive and active flow control for electronics cooling

Patent ·
OSTI ID:1324402

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

Research Organization:
Toyota Motor Engineering & Manufacturing North America, Inc. Erlanger, KY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
EE0006429
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Patent Number(s):
9,445,526
Application Number:
14/578,906
OSTI ID:
1324402
Resource Relation:
Patent File Date: 2014 Dec 22
Country of Publication:
United States
Language:
English

References (27)

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Forced vaporization heat sink for semiconductor devices patent May 1981
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Apparatus for cooling semiconductor device and computer having the same patent April 1995
Method and apparatus for transferring heat, mass, and momentum between a fluid and a surface patent August 1996
Modular coolant manifold for use with power electronics devices having integrated coolers patent April 2001
Method and apparatus for controlling a temperature of a microelectronic substrate patent December 2004
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages patent March 2007
Heat sink with microchannel cooling for power devices patent April 2008
Intelligent cooling method combining passive and active cooling components patent February 2011
Integral heat sink with spiral manifolds patent February 2012
System and method for facilitating parallel cooling of liquid-cooled electronics racks patent June 2012
Reactor with upper and lower manifold structures patent September 2012
Cooling system for burn-in unit patent-application June 2002
Heat exchanger with internal slotted manifold patent-application July 2003
Radiator Plate Rapid Cooling Apparatus patent-application November 2005
Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins patent-application November 2006
Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Employing a Manifold Structure with Interleaved Coolant Inlet and Outlet Passageways patent-application October 2008
Liquid Cooled Rack with Optimized Air Flow Rate and Liquid Coolant Flow patent-application February 2010
Heat Exchanger for Electronic Assemblies patent-application June 2012
Fluid Heat Exchange Systems patent-application June 2012
Multichannel Heat Exchanger with Dissimilar Flow patent-application October 2012
Artificial Muscle Camera Lens Actuator patent-application June 2014
Two-Sided Jet Impingement Assemblies and Power Electronics Modules Comprising the Same patent-application December 2015
Manifold microchannel heat sink design using optimization under uncertainty journal February 2014
Numerical study of flow uniformity and pressure characteristics within a microchannel array with triangular manifolds journal May 2013
Design Optimization of Manifold Microchannel Heat Sink Through Evolutionary Algorithm Coupled With Surrogate Model journal April 2013

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