Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films.

Vianco, Paul T.; Neilsen, Michael K.; Rejent, Jerome A.; Grant, Richard P.

doi:10.1007/s11664-015-3779-4

Title: Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films.

Conference · Sat Nov 01 00:00:00 EDT 2014

DOI:https://doi.org/10.1007/s11664-015-3779-4· OSTI ID:1319745

Vianco, Paul T.; Neilsen, Michael K.; Rejent, Jerome A.; Grant, Richard P.

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Research Organization:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1319745

Report Number(s):: SAND2014-19489C; 541011

Resource Relation:: Journal Volume: 44; Journal Issue: 10; Conference: Proposed for presentation at the 8th International Symposium on Sn Whiskers held October 29, 2014 in Raleigh, NC.

Country of Publication:: United States

Language:: English

References (27)

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Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study Vianco, P. T.; Rejent, J. A. Journal of Electronic Materials, Vol. 38, Issue 9 https://doi.org/10.1007/s11664-009-0882-4	journal	July 2009
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Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films Sarobol, P.; Koppes, J. P.; Chen, W. H. Materials Letters, Vol. 99 https://doi.org/10.1016/j.matlet.2013.02.066	journal	May 2013
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A full-field crystal plasticity study on how texture and grain structure influences hydrostatic stress in thermally strained β -Sn films Chakraborty, Aritra; Eisenlohr, Philip Journal of Applied Physics, Vol. 124, Issue 2 https://doi.org/10.1063/1.5029933	journal	July 2018

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