skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement

Abstract

Our paper reports the measurement and characterization of a fully integrated oven controlled microelectromechanical oscillator (OCMO). The OCMO takes advantage of high thermal isolation and monolithic integration of both aluminum nitride (AlN) micromechanical resonators and electronic circuitry to thermally stabilize or ovenize all the components that comprise an oscillator. Operation at microscale sizes allows implementation of high thermal resistance platform supports that enable thermal stabilization at very low-power levels when compared with the state-of-the-art oven controlled crystal oscillators. A prototype OCMO has been demonstrated with a measured temperature stability of -1.2 ppb/°C, over the commercial temperature range while using tens of milliwatts of supply power and with a volume of 2.3 mm3 (not including the printed circuit board-based thermal control loop). Additionally, due to its small thermal time constant, the thermal compensation loop can maintain stability during fast thermal transients (>10 °C/min). This new technology has resulted in a new paradigm in terms of power, size, and warm up time for high thermal stability oscillators.

Authors:
 [1];  [1]
  1. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1236202
Report Number(s):
SAND-2015-0202J
Journal ID: ISSN 1057-7157; 562129
Grant/Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article: Accepted Manuscript
Journal Name:
Journal of Microelectromechanical Systems
Additional Journal Information:
Journal Volume: 24; Journal Issue: 6; Journal ID: ISSN 1057-7157
Publisher:
IEEE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; oscillator; alluminum nitride; resonator; oven controlled micro electromechanical oscillator (OCMO); oven controlled crystal oscillator (OCXO); turn over temperature

Citation Formats

Wojciechowski, Kenneth E., and Olsson, Roy H. A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement. United States: N. p., 2015. Web. doi:10.1109/JMEMS.2015.2441045.
Wojciechowski, Kenneth E., & Olsson, Roy H. A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement. United States. https://doi.org/10.1109/JMEMS.2015.2441045
Wojciechowski, Kenneth E., and Olsson, Roy H. 2015. "A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement". United States. https://doi.org/10.1109/JMEMS.2015.2441045. https://www.osti.gov/servlets/purl/1236202.
@article{osti_1236202,
title = {A fully integrated oven controlled microelectromechanical oscillator – Part II. Characterization and measurement},
author = {Wojciechowski, Kenneth E. and Olsson, Roy H.},
abstractNote = {Our paper reports the measurement and characterization of a fully integrated oven controlled microelectromechanical oscillator (OCMO). The OCMO takes advantage of high thermal isolation and monolithic integration of both aluminum nitride (AlN) micromechanical resonators and electronic circuitry to thermally stabilize or ovenize all the components that comprise an oscillator. Operation at microscale sizes allows implementation of high thermal resistance platform supports that enable thermal stabilization at very low-power levels when compared with the state-of-the-art oven controlled crystal oscillators. A prototype OCMO has been demonstrated with a measured temperature stability of -1.2 ppb/°C, over the commercial temperature range while using tens of milliwatts of supply power and with a volume of 2.3 mm3 (not including the printed circuit board-based thermal control loop). Additionally, due to its small thermal time constant, the thermal compensation loop can maintain stability during fast thermal transients (>10 °C/min). This new technology has resulted in a new paradigm in terms of power, size, and warm up time for high thermal stability oscillators.},
doi = {10.1109/JMEMS.2015.2441045},
url = {https://www.osti.gov/biblio/1236202}, journal = {Journal of Microelectromechanical Systems},
issn = {1057-7157},
number = 6,
volume = 24,
place = {United States},
year = {Wed Jun 24 00:00:00 EDT 2015},
month = {Wed Jun 24 00:00:00 EDT 2015}
}

Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record

Citation Metrics:
Cited by: 19 works
Citation information provided by
Web of Science

Save / Share:

Works referencing / citing this record:

Dynamic Q -enhancement in aluminum nitride contour-mode resonators
journal, October 2019


Performance of clock sources and their influence on time synchronization in wireless sensor networks
journal, September 2019