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Title: Optical interconnect assembly

Abstract

An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.

Inventors:
;
Publication Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1183928
Patent Number(s):
9,052,485
Application Number:
13/759,696
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
DOE Contract Number:  
AC04-01AL66850
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
97 MATHEMATICS AND COMPUTING; 42 ENGINEERING

Citation Formats

Laughlin, Daric, and Abel, Philip. Optical interconnect assembly. United States: N. p., 2015. Web.
Laughlin, Daric, & Abel, Philip. Optical interconnect assembly. United States.
Laughlin, Daric, and Abel, Philip. 2015. "Optical interconnect assembly". United States. https://www.osti.gov/servlets/purl/1183928.
@article{osti_1183928,
title = {Optical interconnect assembly},
author = {Laughlin, Daric and Abel, Philip},
abstractNote = {An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.},
doi = {},
url = {https://www.osti.gov/biblio/1183928}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 09 00:00:00 EDT 2015},
month = {Tue Jun 09 00:00:00 EDT 2015}
}

Works referenced in this record:

Optical interconnect using microlens/minilens relay
patent, January 2002


Small-scale optoelectronic package
patent, June 2005


Integrated optical transducer assembly
patent, November 2005


Miniature MT optical assembly (MMTOA)
patent, April 2008