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Title: Method of fabricating a high aspect ratio microstructure

Patent ·
OSTI ID:1174305

The present invention is for a method of fabricating a high aspect ratio, freestanding microstructure. The fabrication method modifies the exposure process for SU-8, an negative-acting, ultraviolet-sensitive photoresist used for microfabrication whereby a UV-absorbent glass substrate, chosen for complete absorption of UV radiation at 380 nanometers or less, is coated with a negative photoresist, exposed and developed according to standard practice. This UV absorbent glass enables the fabrication of cylindrical cavities in a negative photoresist microstructures that have aspect ratios of 8:1.

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC02-98CH10886
Assignee:
Brookhaven Science Associates, LLC (Upton, NY)
Patent Number(s):
6,558,868
Application Number:
09/785,053
OSTI ID:
1174305
Country of Publication:
United States
Language:
English

References (2)

Application of the LIGA process for fabrication of gas avalanche devices journal June 2000
Micromachining applications of a high resolution ultrathick photoresist journal November 1995

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