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Title: Laser cutting system

Patent ·
OSTI ID:1171654

A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.

Research Organization:
Johnson Controls-SAFT Advanced Power Solutions LLC, Wilmington, DE (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC26-05NT42403
Assignee:
Johnson Controls--SAFT Advanced Power Solutions LLC (Wilmington, DE)
Patent Number(s):
8,969,756
Application Number:
12/637,578
OSTI ID:
1171654
Resource Relation:
Patent File Date: 2009 Dec 14
Country of Publication:
United States
Language:
English

References (9)

Method and apparatus for the control of shielding gases used in power laser processes patent March 1982
Cutting assembly patent February 1984
Plant for processing by cutting material with the aid of a laser beam patent April 1986
Optics and environmental protection device for laser processing applications patent October 1994
Apparatus and method for laser engraving thin sheet-like materials patent April 1996
Method of supplying laser cutting gas and cutting apparatus implementing such a method patent October 1996
High pressure oxygen assisted laser cutting method patent March 1998
Exhaust system for a laser cutting device patent May 1999
Apparatus and method for processing patent October 2001

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