High-speed photonic modulator designs
Abstract
An optical device includes a microdisk optical resonator element. The microdisk resonator element is formed on a substrate and has upper and lower portions respectively distal and proximal the substrate. An arcuate semiconductor contact region partially surrounds the microdisk resonator element. A first modulator electrode is centrally formed on the upper portion of the microdisk resonator element, and a second modulator electrode is formed on the arcuate contact region. A laminar semiconductor region smaller in thickness than the microdisk resonator element separates the arcuate contact region from the microdisk resonator element and is formed on the substrate so as to electrically connect the arcuate contact region to the lower portion of the microdisk resonator element.
- Inventors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1169061
- Patent Number(s):
- 8,947,764
- Application Number:
- 13/860,978
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
DeRose, Christopher, and Zortman, William A. High-speed photonic modulator designs. United States: N. p., 2015.
Web.
DeRose, Christopher, & Zortman, William A. High-speed photonic modulator designs. United States.
DeRose, Christopher, and Zortman, William A. 2015.
"High-speed photonic modulator designs". United States. https://www.osti.gov/servlets/purl/1169061.
@article{osti_1169061,
title = {High-speed photonic modulator designs},
author = {DeRose, Christopher and Zortman, William A},
abstractNote = {An optical device includes a microdisk optical resonator element. The microdisk resonator element is formed on a substrate and has upper and lower portions respectively distal and proximal the substrate. An arcuate semiconductor contact region partially surrounds the microdisk resonator element. A first modulator electrode is centrally formed on the upper portion of the microdisk resonator element, and a second modulator electrode is formed on the arcuate contact region. A laminar semiconductor region smaller in thickness than the microdisk resonator element separates the arcuate contact region from the microdisk resonator element and is formed on the substrate so as to electrically connect the arcuate contact region to the lower portion of the microdisk resonator element.},
doi = {},
url = {https://www.osti.gov/biblio/1169061},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Feb 03 00:00:00 EST 2015},
month = {Tue Feb 03 00:00:00 EST 2015}
}