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Title: Focal plane array with modular pixel array components for scalability

Patent ·
OSTI ID:1165103
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A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
8,907,439
Application Number:
13/163,909
OSTI ID:
1165103
Resource Relation:
Patent File Date: 2011 Jun 20
Country of Publication:
United States
Language:
English

References (9)

Two-color grating coupled infrared photodetector patent September 2002
Modular digital pixel sensor system patent October 2004
Heterogeneously integrated microsystem-on-a-chip patent February 2008
Image sensor and method for manufacturing the same patent June 2010
Programmable senor array patent-application January 2005
Images with High Speed Digital Frame Transfer and Frame Processing patent-application December 2008
Optical Focal Plane Data Coupler patent-application March 2009
On-Wafer Butted Microbolometer Imaging Array patent-application October 2010
3-Dimensional Hybrid Camera and Production System patent-application December 2010

Cited By (1)

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