A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment.
Conference
·
OSTI ID:1141164
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1141164
- Report Number(s):
- SAND2011-3519C; 506086
- Resource Relation:
- Conference: Proposed for presentation at the 61st Electronic Components and Technology Conference held May 31 - June 3, 2011 in Lake Buena Vista, FL.
- Country of Publication:
- United States
- Language:
- English
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