Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding
Journal Article
·
· Proceedings of Science
OSTI ID:1128835
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), High Energy Physics (HEP)
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 1128835
- Report Number(s):
- FERMILAB-PUB-14-020-PPD
- Journal Information:
- Proceedings of Science, Conference: Presented at VERTEX 2014 - 23rd International Workshop on Vertex Detectors: VERTEX 2014 - 23rd International Workshop on Vertex Detectors. Doksy, Czech Republic, .
- Country of Publication:
- United States
- Language:
- English
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