Wafer-level packaging with compression-controlled seal ring bonding
Patent
·
OSTI ID:1107804
A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- 8,575,748
- Application Number:
- 13/324,076
- OSTI ID:
- 1107804
- Country of Publication:
- United States
- Language:
- English
Wafer level packaging using flip chip mounting
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patent | December 2012 |
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